ROBOTIQ BRINGS THE SENSE OF TOUCH TO PHYSICAL AI
Robots can now “feel” objects: Robotiq launches an innovation that could transform industrial automation
Industrial automation is entering a new phase. After vision, connectivity and data analysis, it is now the sense of touch that is emerging as a strategic lever to improve robot reliability in real-world environments. On January 27, 2026, Robotiq announced the launch of its TSF-85 tactile sensor fingertips for its 2F-85 Adaptive Gripper, with the ambition of enabling Physical AI systems to handle objects in a more precise, safer and more robust way at scale.
In concrete terms, this new solution adds a sensory layer to robotic gripping. Until now, many automated systems have relied mainly on vision and predefined mechanical settings. With the TSF-85, the robot no longer simply “sees” an object: it can also detect contact, adjust its grip and better interpret the physical interaction with the product. According to Robotiq, the goal is to make handling more reliable in real-world applications, where variability in shapes, textures or positioning remains a major challenge.
The potential is particularly strong for manufacturers dealing with complex flows, high speeds or delicate products. In packaging, packing, logistics and palletising operations, a robot’s ability to instantly adapt its grip can help reduce handling errors, limit line stoppages and further secure operations. It is also an important issue for companies seeking to upgrade their automation capabilities, especially when they want to manage a wider variety of product references without redesigning their entire architecture. This logic of incremental performance improvement is also at the heart of the transformations followed by ALLFORPACK EMBALLAGE PARIS 2026, scheduled to take place from November 24 to 26, 2026 at Paris Nord Villepinte.
Robotiq also highlights a key point for integrators and already equipped industrial sites: the TSF-85 integrates directly with existing 2F-85 grippers, via native RS-485 communication and a USB conversion board. The company also states that the solution preserves pinch and enveloping gripping mechanics with limited impact on stroke and reach, while incorporating cabling designed for industrial use. In other words, the promise is not only technological: it is also operational, with a simpler deployment logic from pilot projects to larger fleets.
This development illustrates a deeper trend: industrial robotics is no longer seeking only to be faster, but also more sensitive, more adaptable and more contextual. In the worlds of packaging and intralogistics, where product references are multiplying and flexibility requirements are increasing, the ability to enrich robots with new forms of perception is becoming a competitive advantage. Physical AI, still often perceived as an emerging concept, takes on a very concrete dimension here: that of a machine capable of interacting better with the physical world, in the service of smarter and more resilient lines.
For visitors and exhibitors at ALLFORPACK EMBALLAGE PARIS 2026, this type of announcement offers a glimpse of the technologies that could redefine automation standards in the years ahead. The show, which brings together the entire packaging and intralogistics chain, is positioned precisely as a privileged place to observe these innovations, whether in productivity, robotisation, decarbonisation or flow optimisation. In this sense, the launch of the TSF-85 by Robotiq goes beyond the simple product framework: it reflects a broader move towards finer, more reliable automation that is better suited to on-the-ground realities.